1-5Pcs Thermal Paste Conductive Heatsink Plaster Viscous Adhesive For Chip VGA LED IC Cooler Radiator Cooling Sealers
SPECIFICATIONS
Brand Name: NONE
Capacity: 7ml
Certification: REACH
Choice: yes
High-concerned chemical: None
Material: Other
Model Number: /
Origin: Mainland China
Packing Pattern: Pen Style
Type: Liquid Glue
semi_Choice: yes
product description
Product parameters:
Melting capacity: 0 (200C/24Hours)
Evaporation capacity: o.001% (200C/24Hours)
Thermal conductivity: 0.671W/m-K
Thermal impedance: 0.06
Setting time: 3min (25℃)
Bonding strength: 25Kg
Insulation factor5.1
Dissipation coefficient0.005
Independent vacuum packaging
Scope of application:
It has a high-strength, fast-speed effect, and is suitable for various components that need to be directly firmly, LEDs and heat sinks, etc.
1. Used as a heat transfer medium for electronic components.
2. Computer CPU, GPU (graphics card chip) and radiator filling and heat conduction.
3. The filling of the between the high-power transistor and the aluminum
4. The filling of the where the silicon controlled diode contacts the aluminum
5. Reduce the working temperature of various heating etc.
Product performance:
Good thermal conductivity, strong adhesion. Vacuum package is not easy to oxidize and dry out. Good viscosity. Short drying time. Good performance. Various chips are recommended for heat dissipation.
It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. The product has good conductivity and a wide temperature range (-60200℃).
It can withstand high temperature of 300℃ in a short time. In addition, it has short curing time, strong adhesion, long storage period, solvent-free, and can be safely used in the elastic heat dissipation, insulation and packaging of electronics, electrical appliances, instrumentation, LED, heat sink and other industries.
Instructions:
1. When using, directly squeeze out the product, rub it with the of the adherend, and cover it immediately after use, in case it is tried again;
2. The fixation speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa;
3. Recommended coating thickness: 0.1-0.5mm, the thinner the better.
4. Please clean the of the object with solvent (such as alcohol) before use. Do not use detergent to clean it. Do not apply it until the is clean.
Packing specification: 5g/piece (packing has good air tightness, and the outer vacuum bag isolates the air, which increases the storage time).
Package Includes:
1x Heatsink Plaster











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