SPECIFICATIONS

Brand Name: NONE

Capacity: 10ml

Choice: yes

Configuration: RL-035E*1/Push rod*1/Needle*3

Gross weight: 27g

High-concerned chemical: None

Material: Other

ModeL: RL-035E

Model Number: RL-035E

Net content: 10CC

Origin: Mainland China

Packaging size: 184*70mm

Product namE: Chip adhesive

Product size: 95*34*29mm

Type: Liquid Glue

RELIFE RL-035E BGA Chip Seam Glue High Temperature Resistance for Curved Flat Screen Mobile Phone Repair Chip Adhesive

RELIFE RL-035E Chip Adhesive

.Applicable to hard disk sealing, CPU sealing, screen IC sealing, etc.

.Effectively prevents the penetration of moisture and dust, providing reliable protection for the bonded object

.Strong durability, high-strength bonding，High temperature resistance

.Can achieve fast curing and provide long-lasting protection for mobile phones